Company record
MicroNano Core
Updated · Presspool
全球首创三维存算一体AI芯片公司 — the world's first 3D compute-in-memory AI chip company, building AI inference chips (company's words, translated). nanocorechip.com
Funding
- over RMB 1 billion (超10亿元) Series C2 (C2轮), announced October 28, 2026. Led by JianTou Investment (建投投资). Company news post dated 2026-10-28 (in store week), marked 原创：微纳核芯: completed a C2 round of over RMB 1 billion, led by 建投投资, with 杭州资本, 凯泰资本, 晓池资本, 烟台财金, 盛堃投资, 国投泰康, 领阳基金 and existing shareholders. Counting the C1, it raised over RMB 2B in two months and RMB 3B cumulatively in six months. Its homepage calls it an AI chip company (人工智能芯片企业) aimed at large-model inference compute, so AI compute passes on its own words. The round is non-USD, so the store's amount_usd of 150114000 should be null. The company also posted on 2026-11-10 that it completed its conversion to a joint-stock company (股份制改造). That is a common pre-IPO step and does not affect this private round. TechNode (Oct 30) and Wallstreetcn via Longbridge (Oct 28) match the amount and lead. Company legal name: Hangzhou MicroNano Core Electronic Technology (微纳核芯). Listed in the AI startup funding roster for October 26–31, 2026. Sources: MicroNano Core company news (2026-10-28), TechNode, Longbridge / Wallstreetcn.
Whether AI names MicroNano Core
- Machine Relations Index: Not cited in any Machine Relations Index answer, May 10, 2026 to November 10, 2026.
Related records
Closest rounds in the roster for October 26–31, 2026: NanoForge AI (KRW 14.6 billion Seed, October 30, 2026), ALLOX (US$10.5 million seed, October 29, 2026), Bites ($40 million Series A, October 29, 2026), Bleu Robotics (€5 million Pre-seed, October 29, 2026), Bloomsco (C$1 million Pre-seed, October 29, 2026), Collective ($40 million Series B, October 29, 2026).